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Published: September 12, 2022 (3 weeks ago)
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Svetlana Ruzic, Djangoboyz

Svetlana Ruzic, who also goes by the stage name Djangoboyz, is a Serbian based Austrian (Benelux) producer, DJ and composer. Having been active in the alternative music scene since the early 1990s, she started out as a recording and production student. After graduating in Music Business, she established her own production and DJ studio. She is also working as a music journalist and has her own radio show on Raiffeisen FM.The present invention relates generally to a semiconductor device and a method of manufacturing the same. More particularly, the present invention relates to a semiconductor device and a method of manufacturing the same, capable of improving adhesion of a solder bump.
In the past, an under bump metallurgy (UBM) was formed after forming an array of solder bumps on a wafer. Thus, after forming an array of solder bumps by a process such as electroplating, the wafer is transferred to another process to form an UBM layer on the solder bumps. The UBM is composed of a nickel layer and a copper layer deposited onto a wafer, by using photolithography and electroplating processes. After depositing an insulating layer on the wafer, a via hole is formed to penetrate the insulating layer and exposed portions of the wafer, and a through-hole is formed to penetrate the solder bumps and the insulating layer.
However, in the process described above, when the solder bumps are formed, even in the portions where the metallic interconnects for connecting the solder bumps to the UBM layer are completed, the UBM layer is not deposited. Therefore, adhesion of the solder bumps to the UBM layer is low, and in severe conditions, the UBM layer and the solder bump are peeled off from the wafer. The UBM layer and the solder bump are peeled off from the wafer during a process such as a solder process, and this is known as post-solder process failure.
In another method, a solder bump is formed on a wafer, and an UBM layer is formed on the solder bump. Then, a portion of the UBM layer on the solder bump is removed from around a region of the solder bump exposed by the through-hole. For example, the UBM layer is removed by etching the UBM layer by using a dry etching process. However, when the U
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